FEATURES
One large heat sink for ARM processor, two small heat sinks one for LAN controller and the other for 3.3V regulator 3M adhesive thermal tape for efficient thermal transfer to the heat sink, providing additional cooling to the IC Can be used with other devices such as the Beaglebone to cool processor, regulators, etc. Also work on the SMCI USB/NIC controller chip, although it is somewhat larger than the chip itself Mainly compatible with Ardunio High-class aluminum ensures its good durability and strength
Specifications
Material
Aluminum
Color
Multi-color
Dimensions
(0.55 x 0.55 x 0.24)" / (1.4 x 1.4 x 0.6)cm (L x W x H)
Weight
0.07oz / 2g
Package Includes
1 x Chip Heat Dissipation Panel (14 x 14 x 6 mm)2 x Chip Heat Dissipation Panels (8 x 8 x 4 mm)